BGA COAT underfill interconnect for BGA components Improve reballing & reflow repairs on GPU
BGA COAT underfill interconnect for BGA components Improve reballing & reflow repairs on GPU: Computers & Accessories. BGA COAT underfill interconnect for BGA components Improve reballing & reflow repairs on GPU: Computers & Accessories. BGA COAT creates an interconnect between the BGA component and the PCB. The component is strongly attached on the PCB and the chances of mechanical damage (such as after a drop test) is practically eliminated. 。 BGA COAT creates a coating around the solder balls of the component. The solder balls are protected from environmental effects such as humidity and oxidation and the chances of joint fracture is limited. Also the phenomenon of tin whisker growth is limited and the flow of solder from one joint to another 。 BGA COAT has good thermal conductivity (higher than most thermal pads and thermal pastes). This results in equalizing the temperature in the base of the BGA component eliminating the chances of a problem because of partially overheating of the component. It can also create a direct connection between the base of the BGA component and the system's heat-sink. This way the temperature of the base of the BGA is reduced significantly 。 BGA COAT while it cures, absorbs all the humidity that could be located under the component and around the solder balls. This way the solder balls are coated in a dry and well protected environment. 。 BGA COAT can be applied very easily by using only a spatula that is provided. Packaging includes everything that is needed for up to 100 repairs (packet contains enough material to produce around 70ml of BGA COAT. Most BGA components require around 0.5ml of BGA COAT to be placed under them) BGA COAT can keep it's form and size for temperatures up to 250 degrees (Celsius). 。 Important notice! This product is designed for professional use ONLY. It should be used only by technitians with experience on BGA component rework. BGA COAT is a compound designed by Computer Systems laboratories research team, to improve the stability of BGA components on high risk applications (military, automotive, aviation etc). BGA COAT creates an interconnect between the BGA component and the PCB and also a coating around the solder balls of the component. This product is now offered for use on repairs (reballing or reflow of GPU and other BGA components) of commercial electronics such as laptops, gaming consoles etc. BGA COAT performs the process known as under filling. During this proccess a mixture of epoxy adhesives is injected under the device after it is soldered on the PCB. BGA COAT compared to EPOXY adhesives that are used as under fills has the following advantages 1. It is non EPOXY and non toxic. . It can be applied without mechanical means by using only a spatula (provided in the packet) 3. It is commercially available for use in small workshops (EPOXY adhesives for under filling are available for industrial use only) . It has good thermal conductivity (higher than most thermal pads and thermal pastes). This results in equalizing the temperature in the base of the BGA component eliminating the chances of a problem because of partially overheating of the component. Packet contains: X 5ml (50ml in total) of liquid Binder A 1 X 5g of powder Filler B 1 X dispenser with measure indications (ml) 1 X spatula 1 X container box where the product should be stored Price includes VAT 3%. If you are VAT registered in EU please contact us before purchasing and we will offer a quote without VAT. Greek business customers should provide their business info in order to issue a commercial invoice. BGA COAT is produced in EU (Greece) and is shipped directly from our production center in Thessaloniki Greece. 。 。 。
BGA COAT underfill interconnect for BGA components Improve reballing & reflow repairs on GPU
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BGA COAT underfill interconnect for BGA components Improve reballing & reflow repairs on GPU
BGA COAT underfill interconnect for BGA components Improve reballing & reflow repairs on GPU,GPU BGA COAT underfill interconnect for BGA components Improve reballing & reflow repairs on,BGA COAT underfill interconnect for BGA components Improve reballing & reflow repairs on GPU: Computers & Accessories, Official online store Hot pin break out Style outstanding service an easy way to order. Improve reballing & reflow repairs on GPU BGA COAT underfill interconnect for BGA components.
BGA COAT underfill interconnect for BGA components Improve reballing & reflow repairs on GPU
BGA COAT underfill interconnect for BGA components Improve reballing & reflow repairs on GPU
BGA COAT underfill interconnect for BGA components Improve reballing & reflow repairs on GPU: Computers & Accessories, Official online store Hot pin break out Style outstanding service an easy way to order.
